Method for making camera modules and camera module made thereby

ABSTRACT

A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Divisional patent application of co-pendingapplication Ser. No. 12/292,184, filed on 13 Nov. 2008. The entiredisclosure of the prior application, Ser. No. 12/292,184, from which anoath or declaration is supplied, is considered a part of the disclosureof the accompanying Divisional/Continuation application and is herebyincorporated by reference.

This application claims priority of Chinese Application No.200810029455.0, filed on Jul. 10, 2008.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates to a method for making camera modules, moreparticularly to a method for making camera modules in a manner of waferlevel packaging. The invention also relates to a camera module made bythe method.

2. Description of the Related Art

Referring to FIG. 1, Taiwanese Utility Model No. M314431 discloses acamera module 1 including a substrate 11, a sensor chip assembly 12, anda lens assembly 13. The sensor chip assembly 12 is mounted on thesubstrate 11, and is electrically connected to the substrate 11 viasolder balls 121. The lens assembly 13 covers the sensor chip assembly12, and includes a barrel 131 and a lens 132.

Conventionally, the aforesaid camera module 1 is made individually.Therefore, the productivity is low and the production cost is relativelyhigh.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a method for makingcamera modules in a manner of wafer level packaging so that theproductivity can be increased and that the production cost and the sizeof the camera module can be reduced.

Another object of the present invention is to provide a camera modulemade by the method of this invention.

In the first aspect of this invention, a method for making cameramodules includes the steps of: a) providing a wafer including an arrayof sensor chips; b) mounting a plurality of lens assemblies on thesensor chips, respectively, thereby defining a plurality of intersectingspacing grooves among the lens assemblies; c) forming a substrate layerby filling in the spacing grooves with a resin material; and d) cuttingthe wafer and the substrate layer along intersecting cutting lines eachextending along one of the spacing grooves and each intervening the lensassemblies, the substrate layer being divided into a plurality ofbarrels respectively surrounding the lens assemblies.

In the second aspect of this invention, a camera module includes asensor chip, a lens assembly, and a barrel. The sensor chip has a firstsurface and a second surface opposite to the first surface. The lensassembly is mounted on the first surface of the sensor chip and has across-section smaller than that of the sensor chip so that the firstsurface of the sensor chip has an excess surface portion around the lensassembly. The barrel is mounted on the excess surface portion of thefirst surface of the sensor chip and surrounds the lens assembly. Thebarrel has an outer lateral surface flush with a peripheral end of thesensor chip.

BRIEF DESCRIPTION OF THE DRAWINGS

Other features and advantages of the present invention will becomeapparent in the following detailed description of the preferredembodiments with reference to the accompanying drawings, of which:

FIG. 1 is a schematic sectional view of a conventional camera module;

FIGS. 2A to 2G are schematic views illustrating consecutive steps of afirst preferred embodiment of a method for making camera modulesaccording to this invention;

FIGS. 3A to 3H are schematic views illustrating consecutive steps of asecond preferred embodiment of a method for making camera modulesaccording to this invention;

FIGS. 4A to 4I are schematic views illustrating consecutive steps of athird preferred embodiment of a method for making camera modulesaccording to this invention; and

FIGS. 5A to 5J are schematic views illustrating consecutive steps of afourth preferred embodiment of a method for making camera modulesaccording to this invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Before the present invention is described in greater detail, it shouldbe noted that like elements are denoted by the same reference numeralsthroughout the disclosure.

Referring to FIGS. 2A to 2G, the first preferred embodiment of a methodfor making camera modules according to this invention includes the stepsof:

A) providing a wafer:

Referring to FIG. 2A, a wafer 220 is provided, which includes an arrayof sensor chips 22, and has a first surface 221 and a second surface 222opposite to the first surface 221.

B) mounting a surrounding wall:

Referring to FIG. 2B, a surrounding wall 3 is mounted on the firstsurface 221 of the wafer 220. The surrounding wall 3 extends along theperiphery of the wafer 220. In the preferred embodiment, the surroundingwall 3 is connected to the first surface 221 of the wafer 220 in agluing manner.

C) mounting a plurality of lens assemblies:

Referring to FIG. 20, a plurality of lens assemblies 24 aresimultaneously mounted on the sensor chips 22, respectively, using anautomatic equipment (not shown), thereby defining a plurality ofintersecting spacing grooves 4 among the lens assemblies 24. The lensassemblies 24 and the spacing grooves 4 are surrounded by thesurrounding wall 3. The lens assemblies 24 are fixed on the firstsurface 221 of the wafer 220 in a gluing manner. Each of the lensassemblies 24 has a light-transmissive portion 241 on top thereof.

D) filling a resin material:

Referring to FIG. 2D, a resin material is filled into the surroundingwall 3 and the spacing grooves 4 to form a substrate layer 210. In thepreferred embodiment, the substrate layer 210 is substantially flushwith the lens assemblies 24 so as to prevent the light-transmissiveportion 241 of each of the lens assemblies 24 from being covered withthe resin material. The resin material is preferably filled into thesurrounding wall 3 and the spacing grooves 4 at a plurality of fillingspots so as to shorten the filling period.

E) mounting a plurality of conductive blocks:

Referring to FIG. 2E, a plurality of conductive blocks 23 are mounted onbonding pads (not shown) on the second surface 222 of the wafer 220using a surface mounting technology after the resin material issolidified. In the preferred embodiment, the conductive blocks 23 aresolder balls. Alternatively, the conductive blocks 23 can be conductivebumps.

F) cutting the wafer and the substrate layer:

Referring to FIG. 2F, the wafer 220 and the substrate layer 210 are cutalong intersecting cutting lines 6 each extending along one of thespacing grooves 4 and each intervening the lens assemblies 24. Thesubstrate layer 210 is divided into a plurality of barrels 21 (bestshown in FIG. 2G) respectively surrounding the lens assemblies 24.

Referring to FIG. 2G, a plurality of camera modules 2 are madesimultaneously by the aforesaid method. Each of the camera modules 2includes the sensor chip 22, the lens assembly 24, the barrel 21, and aplurality of the conductive blocks 23.

The sensor chip 22 has a first surface 221′ and a second surface 222′opposite to the first surface 221′. The second surface 222′ is providedwith a plurality of bonding pads (not shown) thereon.

The lens assembly 24 is mounted on the first surface 221′ of the sensorchip 22 and has the light-transmissive portion 241 on top thereof. Thelens assembly 24 has a cross-section smaller than that of the sensorchip 22 so that the first surface 221′ of the sensor chip 22 has anexcess surface portion around the lens assembly 24.

The barrel 21 is mounted on the excess surface portion of the firstsurface 221′ of the sensor chip 22 and surrounds the lens assembly 24.The barrel 21 has an outer lateral surface flush with a peripheral endof the sensor chip 22. The barrel 21 is opaque. In the preferredembodiment, the barrel 21 is made of black epoxy resin.

The conductive blocks 23 are mounted on the second surface 222′ of thesensor chip 22. In the preferred embodiment, the conductive blocks 23are solder balls. Alternatively, the conductive blocks 23 can beconductive bumps.

Referring to FIGS. 3A to 3H, the second preferred embodiment of a methodfor making camera modules according to this invention is substantiallyidentical to the first preferred embodiment except for the following.

Referring to FIG. 3D, after the lens assemblies 24 are simultaneouslymounted on the sensor chips 22, respectively, a cover layer 250 ismounted on the lens assemblies 24. The cover layer 250 is in the form ofa thin circular plate having a diameter identical to an inner diameterof the surrounding wall 3. The cover layer 250 includes a plurality oflight-transmissive holes 252 corresponding to the light-transmissiveportions 241 of the lens assemblies 24, and a plurality of injectingholes 251 spaced apart from each other and communicated with the spacinggrooves 4.

Referring to FIG. 3E, after the cover layer 250 is mounted on the lensassemblies 24, the resin material is filled into the surrounding wall 3and the spacing grooves 4 via the injecting holes 251 of the cover layer250 to form the substrate layer 210. In the preferred embodiment, thesubstrate layer 210 has a thickness so that the top surface of thesubstrate layer 210 is substantially flush with the bottom surface ofthe cover layer 250.

Referring to FIG. 3H, each of the camera modules made by the secondpreferred embodiment is substantially similar to each of the cameramodules 2 made by the first preferred embodiment except that each of thecamera modules 2 made by the second preferred embodiment includes acover 25. The cover 25 is mounted on the barrel 21 and the lens assembly24, and has a light-transmissive through hole corresponding to thelight-transmissive portion 241 of the lens assembly 24. The cover 25 hasan outer lateral surrounding surface substantially flush with the outerlateral surface of the barrel 21 and with the peripheral end of thesensor chip 22. The barrel 21 is mounted between the cover 25 and thesensor chip 22.

Referring to FIGS. 4A to 4I, the third preferred embodiment of a methodfor making camera modules according to this invention includes the stepsof:

I) providing a wafer:

Referring to FIG. 4A, a wafer 220 is provided, which includes an arrayof sensor chips 22, and has a first surface 221 and a second surface 222opposite to the first surface 221.

II) mounting a plurality of lens assemblies:

Referring to FIG. 48, a plurality of lens assemblies 24 aresimultaneously mounted on the sensor chips 22, respectively, using anautomatic equipment (not shown), thereby defining a plurality ofintersecting spacing grooves 4 between the lens assemblies 24. The lensassemblies 24 are fixed on the first surface 221 of the wafer 220 in agluing manner. Each of the lens assemblies 24 has a light-transmissiveportion 241 on top thereof.

III) mounting the wafer in a mold:

Referring to FIGS. 4C and 4D, a mold 5 is provided, which includes anupper mold part 53, a lower mold part 51 cooperating with the upper moldpart 53 to define a mold cavity 55, and a plurality of ejecting pins 220opposite to the upper mold part 53 and inserted into the lower mold part51. The wafer 220 is mounted in the lower mold part 51. The upper moldpart 53 is then mounted on the lower mold part 51 so as to close themold 5 and to receive the wafer 220 with the lens assemblies 24 in themold cavity 55. The upper mold part 53 includes an upper mold component531 and a lower mold component 532 cooperating with the upper moldcomponent 531 to define a runner 56. The lower mold component 532 isprovided with a plurality of openings 533 communicating with the spacinggrooves 4.

IV) filling a resin material:

Referring to FIG. 4E, a resin material is filled into the lower moldpart 51 and the spacing grooves 4 through the runner 56, and theopenings 533 of the lower mold component 532 of the upper mold part 53so as to form a substrate layer 210 by insert molding. In the preferredembodiment, the resin material is filled into the lower mold part 51 andthe spacing grooves 4 through a plurality of the openings 533 so as toshorten the filling period.

V) taking the wafer out of the mold:

Referring to FIGS. 4E and 4F, after the resin material is solidified,the upper mold part 53 is moved away from the lower mold part 51, andthe ejecting pins 220 are moved upward so as to eject and take the wafer220 out of the lower mold part 51.

VI) mounting a plurality of conductive blocks:

Referring to FIG. 4G, a plurality of conductive blocks 23 are mounted onbonding pads (not shown) on the second surface 222 of the wafer 220using a surface mounting technology. In the preferred embodiment, theconductive blocks 23 are solder balls. Alternatively, the conductiveblocks 23 can be conductive bumps.

VII) cutting the wafer and the substrate layer:

Referring to FIG. 4H, the wafer 220 and the substrate layer 210 are cutalong intersecting cutting lines 6 each extending along one of thespacing grooves 4 and each intervening the lens assemblies 24. Thesubstrate layer 210 is divided into a plurality of barrels 21 (bestshown in FIG. 41) respectively surrounding the lens assemblies 24.

Referring to FIG. 4I, a plurality of camera modules 2 are madesimultaneously by the aforesaid method. Each of the camera modules 2made by the third preferred embodiment of the method of this inventionis identical to that made by the first preferred embodiment of themethod of this invention.

Referring to FIGS. 5A to 5J, the fourth preferred embodiment of a methodfor making camera modules according to this invention is substantiallyidentical to the third preferred embodiment except for the following.

Referring to FIG. 5D, after the wafer 220 is mounted in the lower moldpart 51, a cover layer 250 is mounted on the lens assemblies 24. Thecover layer 250 is in the form of a thin circular plate having adiameter identical to an inner diameter of the lower mold part 51, Thecover layer 250 includes a plurality of light-transmissive holes 252corresponding to the light-transmissive portions 241 of the lensassemblies 24, and a plurality of injecting holes 251 spaced apart fromeach other and communicated with the spacing grooves 4.

Referring to FIGS. 5E and 5F, after the mold 5 is closed, the resinmaterial is filled into the lower mold part 51 and the spacing grooves 4through the runner 56, the openings 533 of the lower mold component 532of the upper mold part 53, and the injecting holes 251 of the coverlayer 250 so as to form a substrate layer 210 by insert molding.

Referring to FIG. 5J, a plurality of camera modules 2 are madesimultaneously by the aforesaid method. Each of the camera modules 2made by the fourth preferred embodiment of the method of this inventionis identical to that made by the second preferred embodiment of themethod of this invention.

In view of the aforesaid, a plurality of camera modules 2 each having aminiaturized size can be made by the method of this invention.Therefore, the yield is increased and the production cost is reduced.

While the present invention has been described in connection with whatare considered the most practical and preferred embodiments, it isunderstood that this invention is not limited to the disclosedembodiments but is intended to cover various arrangements includedwithin the spirit and scope of the broadest interpretation so as toencompass all such modifications and equivalent arrangements.

1. A lens module, comprising: a sensor chip having a first surface and asecond surface opposite to said first surface; a lens assembly mountedon said first surface of said sensor chip and having a cross-sectionsmaller than that of said sensor chip so that said first surface of saidsensor chip has an excess surface portion around said lens assembly; anda barrel mounted on said excess surface portion of said first surface ofsaid sensor chip and surrounding said lens assembly, said barrel havingan outer lateral surface flush with a peripheral end of said sensorchip.
 2. The lens module as claimed in claim 1, further comprising acover mounted on said barrel and said lens assembly, and having alight-transmissive throughhole.
 3. The lens module as claimed in claim2, wherein said cover has an outer lateral surrounding surfacesubstantially flush with the outer lateral surface of said barrel andwith said peripheral end of said sensor chip, said barrel being mountedbetween said cover and said sensor chip.
 4. The lens modules as claimedin claim 1, further comprising a plurality of conductive blocks mountedon said second surface of said sensor chip.
 5. lens module as claimed inclaim 4, wherein each of said conductive blocks is selected from thegroup consisting of a solder ball and a conductive bump.